Surface and interface characterization of wafer-scale WS2 monolayers in wet-chemical solutions KU Leuven
It is expected that in the 2030 timeframe, CMOS technology nodes could include not only Si based transistors, but also possible ‘Beyond-CMOS’ devices that are co-integrated with the classical CMOS-based solutions. The alternative devices could be used along CMOS for specific functions. For instance, devices are being explored that have two-dimensional transition-metal dichalcogenides (2D TMDCs) as their conduction channel. While device ...