- Parylene C for hermetic and flexible encapsulation of interconnects and electronic components(2013)
Authors: Ahmed Jarboui, Maarten Cauwe, Filip Vermeiren, Rik Verplancke, Hamadi Khemakhem, Jan Vanfleteren, Maaike Op de Beeck
Number of pages: 1
- Adhesion test for UTCP structure in humid environment(2013)
Authors: Kati Kokko, Tom Sterken, Filip Vermeiren, Jan Vanfleteren
Number of pages: 1
- High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)(2012)
Authors: Tom Sterken, Maaike Op de Beeck, Filip Vermeiren, Tom Torfs, Liang Wang, Swarnakamal Priyabadini, Kristof Dhaenens, Dieter Cuypers, Jan Vanfleteren
Pages: 940 - 945
- Embedding thinned chips in flexible PCBs(2012)
Authors: Tom Sterken, Filip Vermeiren, Piers Tremlett, Wim Christiaens, Jan Vanfleteren
Number of pages: 1
- A Reliable and comfortable package for wearable medical devices(2011)
Authors: Tom Sterken, Jan Vanfleteren, Frederick Bossuyt, Steven Brebels, Wim Christiaens, Thomas Vervust, Michal Jablonski, Sheila Dunphy, Filip Vermeiren, Yung-yu Hsu, et al.
Number of pages: 1