- Self-aligned flat ultra-thin chip package for flexible circuits(2013)
Authors: Liang Wang, Maarten Cauwe, Steven Brebels, Walter De Raedt,, Jan Vanfleteren
Pages: 174 - 180
- Design and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz(2013)
Authors: Liang Wang
- High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)(2012)
Authors: Tom Sterken, Maaike Op de Beeck, Filip Vermeiren, Tom Torfs, Liang Wang, Swarnakamal Priyabadini, Kristof Dhaenens, Dieter Cuypers, Jan Vanfleteren
Pages: 940 - 945
- An approach to produce a stack of photo definable polyimide based flat UTCPs(2012)
Authors: Swarnakamal Priyabadini, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, Jan Vanfleteren
Number of pages: 1
- Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide(2012)
Authors: Liang Wang, Tom Sterken, Maarten Cauwe, Dieter Cuypers, Jan Vanfleteren
Pages: 1099 - 1106