Researcher
Kristof Dhaenens
- Disciplines:Scientific computing, Computer theory, Computer hardware, Other computer engineering, information technology and mathematical engineering, Electronics
Affiliations
- Department of Electronics and information systems (Department)
Member
From29 Jan 2001 → Today
Publications
1 - 10 of 12
- Stretchable mould interconnect optimization : peeling automation and carrierless techniques(2019)
Authors: Bart Plovie, Yang Yang, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Frederick Bossuyt, Jan Vanfleteren
Pages: 955 - 962 - 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology(2018)
Authors: Yang Yang, Thomas Vervust, Sheila Dunphy, Steven Van Put, Bjorn Vandecasteele, Kristof Dhaenens, Lieven Degrendele, Lothar Mader, Linde De Vriese, Tom Martens, et al.
- Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers(2017)
Authors: Bart Plovie, Yang Yang, Joren Guillaume, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Thomas Vervust, Frederick Bossuyt, Jan Vanfleteren
Pages: 1700032 - Thermoplastically Shaped Wearable Medical Devices(2017)
Authors: Bart Plovie, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Frederick Bossuyt, Jan Vanfleteren
Number of pages: 1 - 2.5D smart objects using thermoplastic stretchable interconnects(2015)Volume: 2015
Authors: Bart Plovie, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Frederick Bossuyt, Jan Vanfleteren
Pages: 000868 - 000873 - Fabrication and functionalization of PCB gold electrodes suitable for DNA-based electrochemical sensing(2014)
Authors: Pietro Salvo, OYF Henry, Kristof Dhaenens, JLA Sanchez, An Gielen, BW Solnestam, J Lundeberg, CK O'Sullivan, Jan Vanfleteren
Pages: 1705 - 1714 - One-time deformable electronics(2013)
Authors: Imen Chtioui, Sheila Dunphy, Kristof Dhaenens, Maaike Op de Beeck, Mohamed Hedi Bedoui, Jan Vanfleteren, Frederick Bossuyt
Number of pages: 1 - High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)(2012)
Authors: Tom Sterken, Maaike Op de Beeck, Filip Vermeiren, Tom Torfs, Liang Wang, Swarnakamal Priyabadini, Kristof Dhaenens, Dieter Cuypers, Jan Vanfleteren
Pages: 940 - 945 - An approach to produce a stack of photo definable polyimide based flat UTCPs(2012)
Authors: Swarnakamal Priyabadini, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, Jan Vanfleteren
Number of pages: 1 - 3D-stacking of UTCPs as a module miniaturization technology(2011)
Authors: Swarnakamal Priyabadini, An Gielen, Kristof Dhaenens, Wim Christiaens, Steven Van Put, Gerhard Kunkel, Anders Erik Petersen, Jan Vanfleteren
Pages: 463 - 468