Gas leak rate study of MEMS thin film package in different environments KU Leuven
© 2014 IEEE. Hermeticity is an important reliability issue for MEMS thin film packages, but difficult to test due to their small volume. We have developed a novel method based on the thin film damping theory to measure the internal pressure and the leak rate of a MEMS thin-film package. The method uses the Focused Ion Beam (FIB) and Laser Doppler Vibrometer (LDV) to monitor the change of the package resonance frequency with pressure. In this ...