< Back to previous page
Researcher
Ingrid De Wolf
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → Today - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From1 Jan 2012 → 31 Jul 2020 - Department of Materials Engineering (Department)
Member
From1 Oct 2007 → 31 Dec 2011
Projects
1 - 10 of 29
- Developing Tip-Enhanced Raman Spectroscopy for advanced nanoelectronicsFrom1 Mar 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Design-Technology Co-optimization techniques for enablement of MRAM-based Machine Learning hardwareFrom18 Feb 2022 → 31 May 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- Characterization of IMC (intermetallic compound) properties used at 3D stacking high density interconnectsFrom21 Jan 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Machine learning opportunities for reliability researchFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Electron-beam based nanoprobing for failure and defect analysis of sub-10 nm node semiconductor devicesFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Investigation of void dynamics in metal interconnects under electrical mechanical thermal stimuli using physics based models augmented by machine learningFrom22 Nov 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of Monolithic Integrated III-V Laser DevicesFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of thin-film IGZO transistors for logic and memory applicationsFrom22 Sep 2021 → TodayFunding: FWO Strategic Basic Research Grant
- Understanding defect generation/recombination processes in Ge-on-Si photodetectorsFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Active coolant flow control for energy-efficient integrated package level micro-jet coolingFrom7 Jun 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
Publications
11 - 20 of 307
- A multi-energy level agnostic approach for defect generation during TDDB stress(2022)
Authors: Andrea Vici, Ingrid De Wolf
- Gate-Induced-Drain-Leakage (GIDL) in CMOS Enhanced by Mechanical Stress(2022)
Authors: Ingrid De Wolf
Pages: 2214 - 2217 - Deep Understanding of Electron Beam Effects on 2D Layered Semiconducting Devices Under Bias Applications(2022)
Authors: Ingrid De Wolf
- Dielectric Response in Ferroelectrics Near Polarization Switching: Analytical Calculations, First-Principles Modeling, and Experimental Verification(2022)
Authors: Anne Verhulst, Ingrid De Wolf, Jan Van Houdt
Pages: 5345 - 5350 - Hot-Electron-Induced Punch-Through (HEIP) Effect in p-MOSFET Enhanced by Mechanical Stress(2021)
Authors: Anastasiia Kruv, Ingrid De Wolf
Pages: 1424 - 1427 - A multi-energy level agnostic simulation approach to defect generation(2021)
Authors: Andrea Vici, Ingrid De Wolf
- Investigation of the Impact of Externally Applied Out-of-Plane Stress on Ferroelectric FET(2021)
Authors: Ingrid De Wolf
Pages: 264 - 267 - Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns(2020)
Authors: Liang Fang, Ingrid De Wolf, Tine Baelmans
- Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects(2020)
Authors: Ingrid De Wolf
- Impact of Mechanical Stress on 3-D NAND Flash Current Conduction(2020)
Authors: Anastasiia Kruv, Ingrid De Wolf
Pages: 4891 - 4896
Patents
1 - 9 of 9
- Method for the electrical bonding of semiconductor components (Inventor)
- A method for the electrical bonding of semiconductor components (Inventor)
- Method of detecting manufacturing defects by thermal stimulation (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for producing an integrated circuit device with enhanced mechanical properties (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)