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Researcher
Ingrid De Wolf
- Disciplines:Metallurgical engineering
Affiliations
- Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT) (Division)
Member
From1 Aug 2020 → Today - Structural Composites and Alloys, Integrity and Nondestructive Testing (Division)
Member
From1 Jan 2012 → 31 Jul 2020 - Department of Materials Engineering (Department)
Member
From1 Oct 2007 → 31 Dec 2011
Projects
1 - 10 of 29
- Developing Tip-Enhanced Raman Spectroscopy for advanced nanoelectronicsFrom1 Mar 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Design-Technology Co-optimization techniques for enablement of MRAM-based Machine Learning hardwareFrom18 Feb 2022 → 31 May 2022Funding: Own budget, for example: patrimony, inscription fees, gifts
- Characterization of IMC (intermetallic compound) properties used at 3D stacking high density interconnectsFrom21 Jan 2022 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Machine learning opportunities for reliability researchFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Electron-beam based nanoprobing for failure and defect analysis of sub-10 nm node semiconductor devicesFrom23 Dec 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Investigation of void dynamics in metal interconnects under electrical mechanical thermal stimuli using physics based models augmented by machine learningFrom22 Nov 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of Monolithic Integrated III-V Laser DevicesFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Reliability of thin-film IGZO transistors for logic and memory applicationsFrom22 Sep 2021 → TodayFunding: FWO Strategic Basic Research Grant
- Understanding defect generation/recombination processes in Ge-on-Si photodetectorsFrom22 Sep 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
- Active coolant flow control for energy-efficient integrated package level micro-jet coolingFrom7 Jun 2021 → TodayFunding: Own budget, for example: patrimony, inscription fees, gifts
Publications
41 - 50 of 307
- Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation(2019)
Authors: Ingrid De Wolf
Pages: 73 - 78 - Novel technology for microlenses for imaging applications(2018)
Authors: Ingrid De Wolf
Pages: 9296 - 9300 - High Efficiency Polymer based Direct Multi-jet Impingement Cooling Solution for High Power Devices(2018)
Authors: Tiwei Wei, Jun Qian, Ingrid De Wolf, Tine Baelmans
- Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices(2018)
Authors: Tine Baelmans, Ingrid De Wolf
Pages: 1747 - 1755 - Edge Trimming Induced Defects on Direct Bonded Wafers(2018)
Authors: Ingrid De Wolf
- Detection of failure mechanisms in 24–40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera(2018)
Authors: Ingrid De Wolf
Pages: 334 - 338 - Stress Induced Densification of Thin Porous Low-K Films during Nanoindentation(2018)
Authors: Oguzhan Orkut Okudur, Ingrid De Wolf
Pages: 118 - 120 - 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges(2018)
Authors: Tiwei Wei, Ingrid De Wolf, Tine Baelmans
Pages: 2389 - 2396Number of pages: 8 - Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board(2018)
Authors: Filip Vanhee, Davy Pissoort, Ingrid De Wolf
Pages: 1 - 8 - Stress mitigation of 3D-stacking/packaging induced stresses(2018)
Authors: Luka Kljucar, Ingrid De Wolf
Pages: 4D.31 - 4D.36
Patents
1 - 9 of 9
- Method for the electrical bonding of semiconductor components (Inventor)
- A method for the electrical bonding of semiconductor components (Inventor)
- Method of detecting manufacturing defects by thermal stimulation (Inventor)
- Method for aligning micro-electronic components using an alignment liquid and electrostatic alignment as well as corresponding assembly of aligned micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for aligning micro-electronic components (Inventor)
- Method for producing an integrated circuit device with enhanced mechanical properties (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)
- Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side (Inventor)