Researcher
Bjorn Vandecasteele
- Disciplines:Scientific computing, Computer theory, Computer hardware, Other computer engineering, information technology and mathematical engineering, Electronics
Affiliations
- Department of Electronics and information systems (Department)
Member
From1 Aug 1999 → Today
Publications
1 - 10 of 18
- 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology(2018)
Authors: Yang Yang, Thomas Vervust, Sheila Dunphy, Steven Van Put, Bjorn Vandecasteele, Kristof Dhaenens, Lieven Degrendele, Lothar Mader, Linde De Vriese, Tom Martens, et al.
- Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers(2017)
Authors: Bart Plovie, Yang Yang, Joren Guillaume, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Thomas Vervust, Frederick Bossuyt, Jan Vanfleteren
Pages: 1700032 - Thermoplastically Shaped Wearable Medical Devices(2017)
Authors: Bart Plovie, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Frederick Bossuyt, Jan Vanfleteren
Number of pages: 1 - 2.5D smart objects using thermoplastic stretchable interconnects(2015)Volume: 2015
Authors: Bart Plovie, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Frederick Bossuyt, Jan Vanfleteren
Pages: 000868 - 000873 - Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects(2015)
Authors: George Vakanas, O Minho, Biljana Dimcic, Kris Vanstreels, Bjorn Vandecasteele
Pages: 72 - 80 - A KA-Band sige Bicmos power amplifier with 24 DBM output power(2015)
Authors: Ramses Pierco, Guy Torfs, Timothy De Keulenaer, Bjorn Vandecasteele, Jeroen Missinne, Johan Bauwelinck
Pages: 718 - 722 - Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers(2014)Volume: 15
Authors: Jan Vanfleteren, Imen Chtioui, Bart Plovie, Yang Yang, Frederick Bossuyt, Thomas Vervust, Sheila Dunphy, Bjorn Vandecasteele
Pages: 208 - 215 - Sn whisker evaluations in 3D microbumped structures(2014)
Authors: George P. Vakanas, Bjorn Vandecasteele, David Schaubroeck, J De Messemaeker, Geert Willems
Pages: 1982 - 1987 - Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components(2013)
Authors: Kamalpreet Kaur, Jeroen Missinne, Bjorn Vandecasteele, Geert Van Steenberge, Sandeep Perinchery, Edsger Smits, Rajesh Mandamparabil
Number of pages: 1 - Adhesive bonding by SU-8 transfer for assembling microfluidic devices(2012)
Authors: Pietro Salvo, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu, Jan Vanfleteren
Pages: 987 - 991
Patents
1 - 4 of 4