Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

A method to fabricate thermoplastically deformable electronic circuits is presented, with the intent ofachieving low-cost 2.5D free-form rigid smart objects. This by utilizing existing flexible circuit technology based stretchable circuits, in combination with thermoplastic materials. After fabricating the circuit in a flat state, a thermoforming step shapes the device by heating it beyond its glass transition temperature, and pushing it against a mold. Preliminary tests show the feasibility to fabricate simple circuits using off-the-shelf circuit components; showing a minimal decrease in conductivity of the polyimide supported copper-based interconnects.

Publication year:2017

BOF-keylabel:yes

IOF-keylabel:yes

BOF-publication weight:0.1

CSS-citation score:2

Authors:National

Authors from:Higher Education

Accessibility:Closed