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An approach to produce a stack of photo definable polyimide based flat UTCPs
Book Contribution - Book Chapter Conference Contribution
Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.
Book: 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
Number of pages: 1
Publication year:2012
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IOF-keylabel:yes
Accessibility:Open