Investigation of void dynamics in metal interconnects under electrical mechanical thermal stimuli using physics based models augmented by machine learning KU Leuven
Electromigration (EM), stress induced voiding (SIV), stress migration (SM) and thermomigration (TM) have long been major reliability challenges for the microelectronics sector. Drastic increase of power densities and modern integration approaches have increased the intensity of electrical, mechanical and thermal stimuli that induce metallization voiding, thereby necessitating predictive physics-based models that can provide quantitative ...