Publications
Chosen filters:
Chosen filters:
Fatigue crack growth in TRIP steel under positive R-ratios Ghent University
Fatigue crack growth model incorporating surface waviness for Wire+Arc additively manufactured components Ghent University
Wire+Arc additive manufacturing, due to its high deposition rate, is particularly suited for the construction and repair of large-scale components. For the very same reason, however, an important drawback of this process is the pronounced surface waviness. This waviness introduces multiple adjacent peaks and valleys at the component surface, acting as stress concentration sites which can undermine the fatigue performance. In the present work, ...
Numerical Simulation of Fatigue Crack Growth in Straight Lugs Equipped with Efficient Structural Health Monitoring Vrije Universiteit Brussel
This paper addresses the influence of the efficient Structural Health Monitoring system (eSHM) on the fatigue life of straight lug components. The eSHM system is a mechanical fatigue crack detection system developed at the Vrije Universiteit Brussel (VUB). It consists in integrating pressurized capillaries into the to-be-monitored component, so that when a fatigue crack breaches the capillary network, a leak flow is created, and the pressure ...
Front face strain compliance for quantification of short crack growth in fatigue testing Ghent University
Short fatigue crack growth investigation is of considerable scientific interest as it comprises a significant portion of the total fatigue life of a structure. It is very challenging to accurately quantify this stage of fatigue crack growth experimentally. In this article, a novel front face strain compliance technique for single-edge notched specimens subjected to four-point bending is proposed. Finite element analysis is performed to determine ...
Mixed-mode fatigue crack growth in FM73 bonded joints Ghent University
An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP soldered with SAC405 KU Leuven
This paper presents a reliability model for wafer level chip scale packages (WLCSP) assembled with Sn4%Ag 0.5%Cu (SAC 405) solder. The reliability model is based on a creep constitutive model that takes into consideration the dimensions of the solder joints and a thermo-mechanical fatigue crack growth model. The creep constitutive model was derived from over 250 constant load creep tests performed on micro scale specimens with specimen ...