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Researcher
Andrej Ivankovic
- Disciplines:Control systems, robotics and automation, Design theories and methods, Mechatronics and robotics, Computer theory
Affiliations
- Department of Mechanical Engineering (Department)
Member
From1 Oct 2013 → 1 Jul 2014
Publications
1 - 10 of 12
- Effect of 4-point bending test procedure on crack propagation in thin film stacks(2015)
Authors: Luka Kljucar, Andrej Ivankovic, Ingrid De Wolf
Pages: 59 - 63 - Chip-package interaction in 3D stacked IC packages using Finite Element Modelling(2014)
Authors: Andrej Ivankovic, Ingrid De Wolf
Pages: 1200 - 1205 - Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips(2014)
Authors: Andrej Ivankovic, Ingrid De Wolf
Pages: 1517 - 1522 - The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses(2014)
Authors: Andrej Ivankovic, Dirk Vandepitte, Ingrid De Wolf
Pages: 1 - 8 - 3D stacking induced mechanical stress effects(2014)
Authors: Andrej Ivankovic, Ingrid De Wolf
Pages: 309 - 315 - Reliability concerns in copper TSV’s: methods and results(2012)
Authors: Biljana Dimcic, Andrej Ivankovic, Ingrid De Wolf
Number of pages: 5 - FET arrays as CPI sensors for 3D stacking and packaging characterization(2012)
Authors: Andrej Ivankovic, Ingrid De Wolf, Dirk Vandepitte
Pages: 2 - Impact of through silicon via induced mechanical stress on fully depleted bulk FinFET technology(2012)
Authors: Andrej Ivankovic, Ingrid De Wolf
Pages: 18 - Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits
Authors: Andrej Ivankovic, Vladimir Cherman, Bart Vandevelde, Geert Van der Plas, Kenneth June Rebibis, Antonio La Manna, Eric Beyne, Ingrid De Wolf, Dirk Vandepitte
Pages: 34 - 38 - Copper through silicon via induced keep out zone for 10nm node bulk FinFET CMOS technology
Authors: Andrej Ivankovic, Ingrid De Wolf
Pages: 340 - 343