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Publication

Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components

Journal Contribution - Journal Article

Journal: MICROELECTRONICS RELIABILITY

ISSN: 0026-2714

Volume: 74

Pages: 131 - 135

Publication year:2017

DOI: https://doi.org/10.1016/j.microrel.2017.04.008
Handle: http://hdl.handle.net/1854/LU-8538294
WoS Id: 000404308900018

See also: Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components