Mechanical strength characterization of nanoscale material

With the continuous scaling of dimensions in the microelectronics industry, mechanical integration and reliability issues have become a challenge during manufacturing. Therefore, the evaluation of the mechanical properties of integrated layers is of great importance. This topic mainly focuses on the influence of process parameters on the mechanical properties of multilayered thin films. The elastic, plastic behavior, and failure mechanics will be characterized by various methods including SEM, Nanoindentation, etc. The combination of experimental and numerical analysis is used for a better understanding of the mechanical behavior of materials.