A semiconductor component comprising back side I/O signal routing. Interuniversitair Micro-Electronica Centrum vzw
The invention is related to a semiconductor component, for example an integrated circuit chip, comprising a semiconductor substrate (1) having active devices (7) at the front side thereof and I/O terminals (19) at the back side of the component. The terminals are connected to the active devices through TSV connections (16b) and buried rails (15b) in an area (5) of the substrate that is separate from the area (4) in which the active devices are located. According to the invention, the I/O TSV connections (16b) are located in a floating well (25) of the substrate that is separated from the rest ...