Method for dicing a semiconductor substrate into a plurality of dies. Interuniversitair Micro-Electronica Centrum vzw
According to an aspect of the present inventive concept there is provided a method for dicing a semiconductor substrate (100) into a plurality of dies (170), wherein the semiconductor substrate having a front side (101) provided with a plurality of device areas (110), a back side (103), and a plurality of through substrate vias (130). The method comprises defining, from the front side (101) of the semiconductor substrate (100), at least one trench (140) to be formed between adjacent device areas (110a, 110b), forming the at least one trench (140), from the front side (101) of the ...