3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI Universiteit Gent
In this paper, we present the concept, fabrication, process and packaging of a 3D Si photonics interposer. This Si photonics interposer merges passive photonic and electronic functionalities within a single chip. The interposer is populated with active optical and electronic add-ons, which are flip-chip bonded to the interposer using thermo-compression bonding. The interposer itself is then flip-chip bonded to a glass and Si carrier for further ...