Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations Interuniversitair Micro-Electronica Centrum vzw
We benchmarked Co and Ru metallizations against Cu at cryogenic temperatures (5K-300K) by using imec resistivity model and actual interconnects, with widths between 14 and 64 nm. We observed a decrease in resistance as temperature decreases, with Ru and Co exhibiting the largest drop (similar to 50%) due to their larger Temperature Coefficients of Resistance (TCR). For 20nm-wide lines, the calculated TCR was similar to 2000 ppm/degrees C for Ru ...