Publicaties
Monitoring of composite structures for re-usable space applications using FBGs : the influence of low earth orbit conditions Universiteit Gent
Fiber Bragg grating sensors (FBGs) are promising for structural health monitoring (SHM) of composite structures in space owing to their lightweight nature, resilience to harsh environments, and immunity to electromagnetic interference. In this paper, we investigated the influence of low Earth orbit (LEO) conditions on the integrity of composite structures with embedded optical fiber sensors, specifically FBGs. The LEO conditions were simulated ...
Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform Universiteit Gent
Mid-infrared dual-comb spectroscopy, a powerful fast and broadband technique involves two combs that are mixed by free-space beam combining and generating beat signal. Here, we demonstrate for the first time on-chip QCLs integrated with combiners by leveraging Ge-on-Si platform and 3D self-alignment flip-chip assembly.
Towards a full-color microLED display with a patterned quantum dot color conversion layer Universiteit Gent
Micro-light-emitting diode (microLED) based displays are a very promising technology. An advantageous route for realizing full-color microLED displays is using blue microLEDs with a color conversion layer based on quantum dot materials for red and green. We report on suitable patterning techniques for the quantum dot layers.
Laser Doppler spectrum decomposition and time-frequency analysis : from fibre-optics to VCSEL-based microvascular disease monitoring Universiteit Gent
High speed transceivers beyond 1.6Tb/s for data center networks Universiteit Gent
The demand for compute capacity is currently doubling every 3.4months. This has accelerated the need for Terabit optical transceivers for data centre applications. Scaling options, and photonic and electronic technologies that can meet such demand are presented
Packaging of ultra-dynamic photonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems Universiteit Gent
We report the development of a fully non-blocking optical switch fabric, enabling a deterministic and dynamic network infrastructure. Focus is on scalable photonic integration and packaging technologies required to develop a low-cost switch fabric, including micro-transfer-printing of amplifiers, FOWLP for dense photonic-electronic integration, and optical/thermal packaging solutions on IC-substrates.
Silicon photonic temperature sensor : from photonic integrated chip to fully packaged miniature probe Universiteit Gent
With the increased interest in silicon photonics, integration and packaging technologies are essential to transforming photonic integrated circuits (PICs) into functional photonic systems. We describe in detail the process to obtain a fully packaged miniature photonic temperature sensor starting from bare PIC dies having Bragg grating sensors in a silicon waveguide. It is also shown that PICs fabricated via multi-project wafer services can show ...
Compact packaged silicon photonic Bragg grating sensor based on a ball lens interface Universiteit Gent
We demonstrate a ball-lens based optical interface for coupling between a single mode fiber and a silicon grating coupler from the back side of a photonic integrated circuit (PIC). This allows compact packaging solutions and keeps the PIC top side accessible, e.g. for interacting with the environment in case of sensing applications. Different configurations employing 300 mu m diameter ball lenses made of both LASF-35 glass and sapphire were ...
Demonstration of photonic temperature sensor for RTM-6 composite manufacturing process (180°C) integrated with PMOC system Universiteit Gent
We demonstrate a sensing platform for composite manufacturing (RTM-6) process based on silicon photonics, being controlled by novel Process Monitoring Optimization Control (PMOC) system. The photonic multi-sensor is based on bragg grating components, allowing measurements of temperature, pressure and refractive index, and is packaged employing a ball lens fiber-to-chip interface. We present results of the packaged temperature photonic sensor ...