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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
Boekbijdrage - Boekhoofdstuk Conferentiebijdrage
We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.
Boek: 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)
Aantal pagina's: 1
ISBN:9781943580385
Jaar van publicatie:2018