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Publicatie
Sequential 3D
Boekbijdrage - Boekhoofdstuk Conferentiebijdrage
Ondertitel:Key integration challenges and opportunities for advanced semiconductor scaling
In this paper, we review the current progress on 3D sequential device stacking, highlighting the main integration challenges and the possible technological solutions. Next, we explore the potential benefits of 3D sequential stacking at transistor level, CMOS level and for hybrid circuits.
Boek: ICICDT 2018 - International Conference on IC Design and Technology, Proceedings
Series: ICICDT 2018 - International Conference on IC Design and Technology, Proceedings
Pagina's: 145-148
Aantal pagina's: 4
ISBN:9781538625491
Jaar van publicatie:2018
Trefwoorden:3D sequential, junctionless, silicon-on-insulator, thermal budget, wafer bonding
Auteurs:International
Toegankelijkheid:Closed