Design and integration technology for miniature medical microsystems

The electronic subsystem of wearable and implantable devices is constructed using board-level and package-level integration technology and this limits the achievable miniaturization. We will show that this limitation can be overcome by emerging wafer-level integration methods such as chip-in-wire technology. These technologies can even achieve mechanically bendable and stretchable subsystems.

ISBN:978-1-4244-2377-4

Jaar van publicatie:2008

BOF-keylabel:ja

IOF-keylabel:ja

Authors from:Government, Higher Education