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Onderzoeker
Anil Kunwar
- Disciplines:Metallurgie
Affiliaties
- Structurele Materialen (SCALINT) (Afdeling)
Lid
Vanaf1 aug 2020 → 31 mei 2021 - Duurzaam Materialenbeheer (SeMPeR) (Afdeling)
Lid
Vanaf1 aug 2020 → 31 jul 2020 - Duurzaam Materialenbeheer (Afdeling)
Lid
Vanaf18 jun 2018 → 31 jul 2020
Publicaties
1 - 10 van 18
- Insight into the preferential grain growth of intermetallics under electric current stressing - A phase field modeling(2021)
Auteurs: Anil Kunwar
- Superhydrophobic Surface and Lubricant-Infused Surface: Implementing Two Extremes on Electrodeposited Ni-TiO2 Surface to Drive Optimal Wettability Regimes for Droplets' Multifunctional Behaviors(2021)
Auteurs: Anil Kunwar
- Convolutional neural network model for synchrotron radiation imaging datasets to automatically detect interfacial microstructure: An in situ process monitoring tool during solar PV ribbon fabrication(2021)
Auteurs: Anil Kunwar
Pagina's: 230 - 244 - Effect of the degree of supercooling on growth mechanism of Cu6Sn5 in pure Sn/Cu solder joint(2021)
Auteurs: Anil Kunwar
Pagina's: 7528 - 7540 - Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface(2020)
Auteurs: Anil Kunwar, Nele Moelans
Pagina's: 203 - 219 - Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface(2020)
Auteurs: Anil Kunwar, Nele Moelans
- Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step electrodeposition(2020)
Auteurs: Anil Kunwar
- A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering(2020)
Auteurs: Anil Kunwar
Pagina's: 115 - 127 - Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint(2019)
Auteurs: Anil Kunwar
Pagina's: 47 - 53 - Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows(2019)
Auteurs: Anil Kunwar
Pagina's: 4359 - 4369