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Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

Tijdschriftbijdrage - Tijdschriftartikel

A method to fabricate thermoplastically deformable electronic circuits is presented, with the intent ofachieving low-cost 2.5D free-form rigid smart objects. This by utilizing existing flexible circuit technology based stretchable circuits, in combination with thermoplastic materials. After fabricating the circuit in a flat state, a thermoforming step shapes the device by heating it beyond its glass transition temperature, and pushing it against a mold. Preliminary tests show the feasibility to fabricate simple circuits using off-the-shelf circuit components; showing a minimal decrease in conductivity of the polyimide supported copper-based interconnects.
Tijdschrift: ADVANCED ENGINEERING MATERIALS
ISSN: 1438-1656
Issue: 8
Volume: 19
Pagina's: 1700032
Jaar van publicatie:2017
BOF-keylabel:ja
IOF-keylabel:ja
BOF-publication weight:0.1
CSS-citation score:2
Auteurs:National
Authors from:Higher Education
Toegankelijkheid:Closed