- 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology(2018)
Auteurs: Yang Yang, Thomas Vervust, Sheila Dunphy, Steven Van Put, Bjorn Vandecasteele, Kristof Dhaenens, Lieven Degrendele, Lothar Mader, Linde De Vriese, Tom Martens, et al.
- Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components(2017)
Auteurs: Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems
Pagina's: 131 - 135
- Reduced 2nd level solder joint life time of low-CTE mold compound packages
Auteurs: Bart Vandevelde, Riet Labie, Geert Willems, Lieven Degrendele, Maarten Cauwe, Johan De Baets
Aantal pagina's: 1
- In situ monitoring of urine and sweat contamination in bed linen
Auteurs: Bjorn Van Keymeulen, Lieven Degrendele, Frederick Bossuyt, Johan De Baets
Aantal pagina's: 1
- How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Auteurs: Bart Vandevelde, Lieven Degrendele, Maarten Cauwe, Bart Allaert, Ralf Lauwaert, Geert Willems
Pagina's: 94 - 98