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Onderzoeker
Lin Hou
- Disciplines:Metallurgie
Affiliaties
- Structurele Materialen (SCALINT) (Afdeling)
Lid
Vanaf1 aug 2020 → 24 mrt 2021 - Structurele Materialen (Afdeling)
Lid
Vanaf1 nov 2015 → 31 jul 2020
Projecten
1 - 1 of 1
- Vorming van intermetallische componenten in verkleinde soldeerverbindingen gebruikt voor 3D silicium-op-silicium stapelingVanaf27 okt 2015 → 21 sep 2020Financiering: Eigen Middelen zoals patrimonium, inschrijvingsgelden, giften, ....
Publicaties
1 - 10 van 13
- A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking(2020)
Auteurs: Lin Hou, Ingrid De Wolf
Pagina's: 669 - 678 - A Novel Resistance Measurement Methodology for In Situ UBM/Solder Interfacial Reaction Monitoring(2020)
Auteurs: Lin Hou, Ingrid De Wolf
Pagina's: 30 - 38 - Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering(2019)
Auteurs: Lin Hou, Nele Moelans, Ingrid De Wolf
- An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking(2018)
Auteurs: Lin Hou, Ingrid De Wolf
Aantal pagina's: 8 - Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings(2017)
Auteurs: Lin Hou
Aantal pagina's: 2 - Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn(2017)
Auteurs: Lin Hou
Aantal pagina's: 3 - 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures(2017)
Auteurs: Lin Hou
Pagina's: 1 - 3 - Impact of ELD layers in mechanical properties of microbumps for 3D stacking(2016)
Auteurs: Lin Hou, Ingrid De Wolf
Pagina's: 1 - 5 - 3D stacking of Co and Ni based microbumps(2016)
Auteurs: Inge De Preter, Jaber Derakhshandeh, Lin Hou, Carine Gerets, Teng Wang, Kenneth June Rebibis, Andy Miller, Gerald Beyer, Eric Beyne
Pagina's: 1 - 5 - 3D stacking using bump-less process for sub 10 µm pitches(2016)
Auteurs: Lin Hou, Vikas Dubey
Pagina's: 128 - 133
Patenten
1 - 2 van 2