Depolarization of surface scattering in polarized laser scattering detection for machined silicon wafers KU Leuven
Monocrystalline silicon is currently one of the most used materials in the semiconductor industry. However, being hard and brittle, a silicon wafer commonly suffers from machining-induced subsurface damage (SSD). Detecting SSD is important for optimizing the machining process in order to improve the surface integrity of a machined wafer. Among the various detection methods, the polarized laser scattering (PLS) method has a huge potential in ...