Projects
Deep Learning for Advanced Image-Based Semiconductor Metrology KU Leuven
As EUV based lithography gets adopted to keep scaling semiconductor devices in our chips, new metrology and inspection challenges arise. We need to measure these small dimensions fast but without losing accuracy and repeatability. Metrology and inspection are at the heart of process control. Without adequate metrology and inspection capability yields suffer. Conventional process and metrology tools, used in the industry, while generating a ...
Next generation X-ray metrology for meeting industry standards (MetroFlex). University of Antwerp
Fast industrial metrology and inspection based on CAD data and phase contrast measurements. University of Antwerp
Photoresist Metrology and Development for high Numerical Aperture (NA) Extreme Ultraviolet Lithography (EUVL) KU Leuven
Over the past five decades, the integrated circuits (ICs) have seen a continuous increase of computing power while at the same time increasing performance. To achieve this, the number of transistors on the ICs must increase per unit area. This trend, known as Moore’s law, predicts that the number of transistors on an IC doubles every two years. The pattern dimensions (density and size) that can be obtained rely on the use of lithography ...
In-situ dimensional metrology of hybrid manufactured parts KU Leuven
An important roadblock for the further diffusion of laser-based metal additive manufacturing (AM) into the manufacturing industry is the part-to-part consistency in terms of geometrical dimensions. The dimensional accuracy and surface roughness of the manufactured parts are still inferior to that of components that are manufactured by conventional machining methods due to several phenomena that occur during the build-up process, such as ...
Nano-focused Raman spectroscopy for stress and compositional metrology KU Leuven
In advanced nanoelectronics transistor structures, strain can be used as a concept to enhance the mobility of electrons (or holes) in the channel region and thereby increasing the channel conductivity and overall device performance. At the same time, novel transistor channel materials such as compound III-V semiconductors are introduced in 3D integration schemes. Strain and composition measurements for process optimization on these structures ...
Pilot line for advanced freeform glass optics: prototyping, replication and metrology Vrije Universiteit Brussel
Picometer metrology for light-element nanostructures: making every electron count (PICOMETRICS). University of Antwerp
Next generation X-ray metrology for meeting industry standards KU Leuven
Realizing a breakthrough in X-ray metrology for inline industrial quality control by developing an efficient, generic and fully flexible toolbox.