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Efficient regulation of copper homeostasis underlies accession-specific sensitivities to excess copper and cadmium in roots of Arabidopsis thaliana Hasselt University

Rafaela AMARAL DOS REIS, Sophie HENDRIX, MP Mourato, LL Martins, Jaco VANGRONSVELD, Ann CUYPERS
The commonly used Arabidopsis thaliana natural accessions Columbia (Col-0) and Wassilewskija (Ws) are known to differ in their metal sensitivity, with Col-0 being more sensitive to copper (Cu) and cadmium (Cd) than Ws. As both Cu and Cd are known to affect Cu homeostasis, it was investigated whether this process is part of an accession-specific mechanism underlying their difference in metal sensitivity. As roots are the first contact point ...

Stainless steel substrate pretreatment effects on copper nucleation and stripping during copper electrowinning Ghent University

Florian Verbruggen, Erika Fiset, Luiza Bonin, Antonin Prévoteau, Michael S. Moats, Tom Hennebel, Korneel Rabaey
The effects of surface pretreatment of 304 stainless steel (SS) substrates on copper film formation, adhesion, and purity obtained by galvanostatic electrodeposition at a current density of - 30 mA cm(-2) are presented. The polished substrate produced more copper nuclei, resulting in an increase of the adhesion as compared to chemically oxidized SS substrate. The adhesion of the copper deposits was characterized by a Nano-scratch tester (NST). ...

The time-varying effect of thiourea on the copper electroplating process with industrial copper concentrations Vrije Universiteit Brussel

Thomas Marcel Collet, Benny Wouters, Noel Hallemans, Kristof Ramharter, John Lataire, Annick Hubin

Electrorefining is the process of choice to purify several metals, among which is copper. A crucial process parameter in electrorefining, and electroplating in general, is the additive activity. Several additives are introduced to the electrolyte to ensure a morphological smooth copper deposit. Thiourea is a crucial but complex additive used in copper electrorefining, it is known to degenerate and both the reaction product as thiourea itself ...

Electrochemical deposition of a copper carboxylate layer on copper as potential corrosion inhibitor Ghent University University of Antwerp

Alice Elia, Karolien De Wael, Mark Dowsett, Mieke Adriaens
Carboxylic acids and sodium carboxylates are used to protect metals against aqueous and atmospheric corrosion. In this paper we describe the application of a layer of copper carboxylate on the surface of a copper electrode by means of cyclic voltammetry technique, and tests which measure the corresponding resistance to aqueous corrosion. Unlike the soaking process, which also forms a film on the surface, the use of cyclic voltammetry allows one ...

Impaired copper and iron metabolism in blood cells and muscles of patients affected by copper deficiency myeloneuropathy KU Leuven

Marco Spinazzi
AIMS: Severe copper deficiency leads in humans to a treatable multisystem disease characterized by anaemia and degeneration of spinal cord and nerves, but its mechanisms have not been investigated. We tested whether copper deficit leads to alterations in fundamental copper-dependent proteins and in iron metabolism in blood and muscles of patients affected by copper deficiency myeloneuropathy, and if these metabolic abnormalities are associated ...

Electrochemical codeposition of arsenic from acidic copper sulfate baths: the implications for sustainable copper electrometallurgy Vrije Universiteit Brussel Ghent University

Florian Verbruggen, Pieter Ostermeyer, Luiza Bonin, Antonin Prévoteau, Kristof Marcoen, Tom Hauffman, Tom Hennebel, Korneel Rabaey, Michael Moats

Copper producers face increased demand associated with increasing complexity in feedstock composition, including high amounts of impurity metals. In this work, linear sweep voltammetry was used to study the electrodeposition behavior of copper and arsenic, define strategies for the production of grade A copper, and the removal of arsenic from complex electrolytes. Our results show that the copper concentration is a key parameter to control in ...