Projects
Nanoindentation Methodologies for Characterizing Thin (Porous) Low Dielectric Constant Materials and Copper Pads KU Leuven
The continuous scaling of integrated circuits and miniaturization of microelectronic devices with higher device densities to increase the performance, have led to the introduction of highly porous low dielectric constant (low-k) materials and miniature cu nails and pads. A factor that plays an increasing role in the development of these new technologies is mechanical stress. The processing, assembly and packaging of chips introduce stresses ...
OPTIBARRIER : Optimal barriers to sustainable food packaging: balance between over- and under-packaging Hasselt University
Modeling process-structure-property and migration relationships in functionalized polyhydroxyalkanoate nanocomposites for packaging applications Hasselt University
Facing plastics: Quantification and characterization of plastic packaging in mixed household waste streams as a guide to increased circularity KU Leuven
Plastic packaging is a gateway for material losses. Packaging represents about 40% of the European virgin plastics demand, but less than half of it is recycled. On top of that, badly managed and littered plastic packaging contribute to environmental pollution. Since any solution starts with defining the problem, the presented work aims to quantify and characterize plastic packaging that is not collected separately for recycling, but is ...
Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading KU Leuven
With the ever increasing demands for improved performance of ICs, new reliability challenges are arising with the increasing complexity of the interconnect layer, which consists not only of reduction of dimensions, but also the introduction of new materials. One of the main goals of the semiconductor industry is to increase the speed of ICs (both Front-End-Of-Line and Back-End-Of-Line), by reducing the RC delay. While the downscaling ...
Evaluation of the functionality of the new generation compostable bio-bases plastics in food packaging. Hasselt University
Characterization of printed packaging materials (paper / cardboard and plastics) for food: organoleptic and migration issues Ghent University
Of this Project innovativeness will consist of fast off-line to onderzoekn (mass spectrometry-based electronic nose technology or MS-nose TECHNOLOGY and Selected Ion Flow Tube Mass Spectrometry or SIFT-MS) and in-line (convetionele electronic nose, or e-nose) detection and optimize, specifically targeting strong odor compounds from packaging materials. Females will experience gained with paper / cardboard (among others with low odor inks, ...
Active coolant flow control for energy-efficient integrated package level micro-jet cooling KU Leuven
Liquid cooling is a promising technique for the cooling of high-performance and high-power applications. Typical liquid cooling solutions consists of a separate cooling unit with many parallel micro-scale channels, that is mounted on the chip using a thermal interface material as adhesive. For high performance liquid cooling solutions, this thermal interface material represents the thermal bottleneck and prevents boosting the power level for ...