Advance semiconductor wetting and drying: limitations, defect formation and solutions KU Leuven
Semiconductor device fabrication still follows the Moore’s law to increase the process yield by increasing the number of cleaning steps to minimize the number of surface defects. Process induced defect (PID) is a characterization term defined as the main failure mechanism toward efficient cleaning rinsing and drying process. Source of defects might be extrinsic, which represent all contaminations coming from water, ambient and the surface ...