High accuracy transfer printing Ghent University
The disclosure is related to a method for producing at least one semiconductor component coupled to a target substrate, where a coupon comprising one or more constituent layers of the at least one semiconductor component is transferred to the target substrate by transfer printing. The coupon is embedded in a portion of a support layer thereby forming an enlarged coupon provided with solid alignment markers on the underside thereof. Corresponding hollow alignment markers exist on the location of the target substrate where the coupon is to be placed. The alignment markers engage to thereby ...