Publications
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Design of a four-point bend test for ultra-low cycle fatigue of pipelines under inelastic bending Ghent University
This master thesis is situated in the research domain dealing with the ductile failure of pipelines under extreme loading conditions. It is part of an umbrella research aiming to develop innovative experimental and computational methodologies to simulate fracture of steel structural elements under ultralow cycle fatigue. The focus of this study is on steel pipeline applications. The objective of this thesis is to design a large-scale four-point ...
Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling KU Leuven
Fatigue performance of solder joints in four-point bending test is evaluated by finite-element modeling. A simplified modeling technique is implemented in order to focus on the behavior of the critical solder joint. The fatigue life is estimated by taking into account the creep behavior of the solder joints and the utilization of Morrow’s fatigue model. Fatigue life curves are generated for room temperature and two elevated temperatures with the ...
Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling KU Leuven
Fatigue performance of solder joints in four-pointbending test is evaluated by finite-element modeling. A simplifiedmodeling technique is implemented in order to focus on thebehavior of the critical solder joint. The fatigue life is estimatedby taking into account the creep behavior of the solder joints andthe utilization of Morrow’s fatigue model. Fatigue life curves aregenerated for room temperature and two elevated temperatureswith the ...
Finite Element Modeling of Solder Joint Fatigue in Four-Point Bending Test KU Leuven
In this study, the fatigue performance of solder joints in four point bending test was evaluated by a novel finite-element modeling method. A simplified modeling technique was implemented in order to focus on the behavior of the critical solder joint. The fatigue life was estimated by taking into account the creep behavior of solder joints. Morrow's fatigue model was utilized to determine the fatigue life. The results were compared with the ...
Study of the mechanical response of carbon Reinforced concrete beams using Non Destructive Techniques during a four-point bending test Vrije Universiteit Brussel
concrete beam reinforced with carbon-epoxy
Study of the crack propagation in carbon reinforced concrete beams during a four-point bending test Vrije Universiteit Brussel
crack propagation
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components KU Leuven Ghent University
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (PCB) through cyclic board bending. During the cycling, the temperature is kept constant, preferably at elevated temperature in order to accelerate the creep deformation of the solder joint. This is ...
Performance monitoring of large-scale autonomously healed concrete beams under four-point bending through multiple non-destructive testing methods Ghent University Vrije Universiteit Brussel
Concrete is still the leading structural material due to its low production cost and great structural design flexibility. Although it is distinguished by such a high durability and compressive strength, it is vulnerable in a series of ambient and operational degradation factors which all too frequently result in crack formation that can adversely affect its mechanical performance. The autonomous healing system, using encapsulated ...
Four-point bending cycling as alternative for Thermal cycling solder fatigue testing KU Leuven
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (PCB) through cyclic board bending. During the cycling, the temperature is kept constant, preferably at elevated temperature in order to fasten the creep deformation of the solder joint. This is done ...