Publications
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A Survey and Taxonomy of Electronics Toolkits for Interactive and Ubiquitous Device Prototyping Hasselt University
Over the past two decades, many toolkits for prototyping interactive and ubiquitous electronic devices have been developed. Although their technical specifications are often easy to look up, they vary greatly in terms of design, features and target audience, resulting in very real strengths and weaknesses depending on the intended application. These less technical characteristics are often reported inconsistently, if at all. In this paper we ...
High-speed electronics for silicon photonics transceivers Ghent University
Copper nanocrystals-based conductive inks for printed electronics Ghent University
From fibrils to toughness : multi-scale mechanics of fibrillating interfaces in stretchable electronics Ghent University
Heterogeneity in the Solar-Powered Consumer Electronics Market: A Discrete Choice Experiments Study Hasselt University KU Leuven University of Antwerp
Solar-powered consumer electronics are a likely starting point for organic photovoltaic (OPV) market development. Therefore, a generic discrete choice experiments study can determine how Flemish consumers value solar-cell characteristics for solar-powered consumer electronics. Such characteristics include efficiency, lifetime, aesthetics, integratability, and price. We contribute to the literature by investigating preference heterogeneity in a ...
PaperPulse: An Integrated Approach for Embedding Electronics in Paper Designs Hasselt University
We present PaperPulse, a design and fabrication approach that enables designers without a technical background to produce standalone interactive paper artifacts by augmenting them with electronics. With PaperPulse, designers overlay pre-designed visual elements with widgets available in our design tool. PaperPulse provides designers with three families of widgets designed for smooth integration with paper, for an overall of 20 different ...
Photonic flash soldering of thin chips and SMD components on foils for flexible electronics Ghent University
Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using a lead-free solder paste. Results are compared with oven-reflowed solder joints on PI substrates. The delicate PET foil ...
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending Ghent University
Flexible and stretchable electronics Ghent University
Conventionally electronics circuits are produced by assembly of packaged components on flat, rigid printed circuit boards. However there is a growing demand for 2.5 dimensional (2.5D free form surfaces) or even full 3D electronics. Applications for such circuits are found in a vast range of fields: such circuits are desirable for comfort and ergonomic reasons (e.g. in wearable or implantable circuits), to respond to design and aesthetics ...