An integrated circuit chip comprising back-side power delivery tracks Interuniversity Microelectronics Centre
An IC chip according to the invention comprises a semiconductor substrate (1) comprising active devices on its front surface and power delivery tracks (26) on its back surface. The active devices are powered through mutually parallel buried power rails (15), with the power delivery tracks (26) running transversely with respect to the power rails, and connected to said power rails by a plurality of Through Semiconductor Via connections, TSVs (11), which run from the power rails (15) to the back of the substrate. According to the invention, the TSVs (11) are elongate slit-shaped TSVs aligned to ...