Title Abstract "An interconnect, an electronic assembly and a method for manufacturing an electronic assembly." "An interconnect (120; 220) for connecting a first electronic circuit (102; 202) to a second, external stretchable electronic circuit device (110) comprises: conductive lines (104; 204) of the first electronic circuit (102; 202) arranged in a plane; connectors (124; 224) configured to define an overlap in the plane between each end of the conductive lines (104; 204) with a corresponding end of stretchable conductive lines (112) providing an electrical connection between the conductive lines (104; 204) and the stretchable conductive lines (112) over the entire overlap; and at least one ..." "Implantable sensor electronics packaging." "An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the ..." "Thin-film photovoltaic module with integrated electronics and methods for manufacturing thereof." "The disclosure provides a thin-film photovoltaic module comprising a plurality of seriesconnected thin-film photovoltaic cells on an electrically insulating substrate and comprising at least one electronic device integrated with the thin-film photovoltaic module and positioned at a lateral edge of the thin-film photovoltaic module. A first device electrode of the at least one electronic device is electrically connected to a transparent front side electrode of a first thin-film photovoltaic cell by means of a first electrically conductive wire and a second device electrode of the at least one ..." "Thin-film photovoltaic module with integrated electronics and methods for manufacturing thereof" "Marc MEURIS" "The disclosure provides a thin-film photovoltaic module comprising a plurality of series-connected thin-film photovoltaic cells on an electrically insulating substrate and comprising at least one electronic device integrated with the thin-film photovoltaic module and positioned at a lateral edge of the thin-film photovoltaic module. A first device electrode of the at least one electronic device is electrically connected to a transparent front side electrode of a first thin-film photovoltaic cell by means of a first electrically conductive wire and a second device electrode of the at least one ..." "Textile integration of stretchable electronics" "Bjorn Van Keymeulen, Frederick Bossuyt, Thomas Vervust" "A stretchable circuit is mechanically attached to a textile fabric using an adhesive. An electrical connection between the conductive textile yarns and the stretchable interposer is realized by first removing the isolating material between the conductive yarns and an electrical pad on the interposer . Then, a conductive adhesive is applied where the insulation material has been removed in order to realize an electrical connection between the conductive yarn the contact pad. To insulate the whole system an insulation material can be applied at the non-insulated parts of the integrated module." "Trench capacitor device for a superconducting electronic circuit, superconducting qubit device and method for forming a trench capacitor device for a qubit device." "The disclosure relates to a trench capacitor device (100) for a superconducting electronic circuit, comprising: a substrate (102); and a first capacitor electrode (104) and a second capacitor electrode (108), each of a superconductor and extending into the substrate, the first electrode being circumferentially enclosed by the second electrode such that an inwardly facing surface (108a) of the second electrode faces an outwardly facing surface (104a) of the first electrode." "Metal organic framework photonic and electronic device for gas sensing" "Rob Ameloot, Max Lutz Tietze, Margot Verstreken" "The invention relates to gas sensors comprising subsequently arranged from bottomto top: a bottom first layer (1) of a reflective or semi-reflective conductive materialor a bottom first layer (1) which is a distributed Bragg reflector; a second layer (2) with a thickness between 10 and 500 nm, of a material which is transparent or semi-transparent to ultra-violet, visible, or/and near-infrared light, wherein optionally the order of layer (1) and (2) is switched; a third layer (3) of a porous sensing material specifically binding a volatile analyte; an optional fourth layer (4) of an organic ..." "Stent integration of active electronic circuit" "Jan Vanfleteren, Rik Verplancke" "The present invention relates to a method for integrating an electronic circuit in or on a medical stent. The method comprises obtaining (101) a deformable medical stent (21) in a substantially planar shape, in which the deformable medical stent is adapted for being deployed in a substantially cylindrical shape in the body. The method also comprises attaching (104) a deformable electronic circuit (22) onto the deformable medical stent in the planar shape thereby forming a deformable hybrid structure. The method also comprises shaping (107) said hybrid structure into the cylindrical shape." "Stent integration of active electronic circuit" "Jan Vanfleteren, Rik Verplancke" "The present invention relates to a method for integrating an electronic circuit in or on a medical stent. The method comprises obtaining (101) a deformable medical stent (21) in a substantially planar shape, in which the deformable medical stent is adapted for being deployed in a substantially cylindrical shape in the body. The method also comprises attaching (104) a deformable electronic circuit (22) onto the deformable medical stent in the planar shape thereby forming a deformable hybrid structure. The method also comprises shaping (107) said hybrid structure into the cylindrical shape." "Integrated electronic circuit with airgaps" "A method for forming airgaps within an integrated electronic circuit implements a conformal layer (4) and a nanosheet (5) both of boron nitride. The method has advantages for the circuit due to special properties of boron nitride material. In particular, mechanical strength and heat dissipation are increased whereas electro-migration is limited. The invention method may be applied to the first interconnect layer of the integrated circuit, for reducing additionally capacitive interactions existing between gate electrode structures (1) and source or drain contact structures (2, 3)."