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Researcher
Lieven Degrendele
- Disciplines:Scientific computing, Computer theory, Computer hardware, Other computer engineering, information technology and mathematical engineering, Electronics
Affiliations
- Department of Electronics and information systems (Department)
Member
From16 Oct 2000 → Today
Publications
1 - 5 of 5
- 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology(2018)
Authors: Yang Yang, Thomas Vervust, Sheila Dunphy, Steven Van Put, Bjorn Vandecasteele, Kristof Dhaenens, Lieven Degrendele, Lothar Mader, Linde De Vriese, Tom Martens, et al.
- Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components(2017)
Authors: Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems
Pages: 131 - 135 - Reduced 2nd level solder joint life time of low-CTE mold compound packages
Authors: Bart Vandevelde, Riet Labie, Geert Willems, Lieven Degrendele, Maarten Cauwe, Johan De Baets
Number of pages: 1 - In situ monitoring of urine and sweat contamination in bed linen
Authors: Bjorn Van Keymeulen, Lieven Degrendele, Frederick Bossuyt, Johan De Baets
Number of pages: 1 - How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Authors: Bart Vandevelde, Lieven Degrendele, Maarten Cauwe, Bart Allaert, Ralf Lauwaert, Geert Willems
Pages: 94 - 98