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Publication

Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Journal Contribution - Journal Article

Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN: 2156-3985
Issue: 5
Volume: 9
Pages: 955 - 962
Publication year:2019
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:0.1
Authors:International
Authors from:Government
Accessibility:Open