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Recent advances in interconnect technology for slim-base biomedical probe arrays

Book Contribution - Book Chapter Conference Contribution

An interconnect technology for out-of-plane biomedical probe arrays has been demonstrated. The shafts of the probe array are assembled perpendicular to a common base or platform. During assembly of the probes a mechanical and electrical connection has been made. In order to assess the integrity of the assembly, a pulling test has been done. Recently the interconnect density has been improved to a pitch of 35 μ m to realize the interconnects for active probe arrays. ©2009 IEEE.
Book: the 15th international conference on Solid-State Sensors, Actuators & Microsystems
Pages: 1975 - 1978
Publication year:2009