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Publication

A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking

Journal Contribution - Journal Article

Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950
Issue: 4
Volume: 10
Pages: 669 - 678
Publication year:2020
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:1
Authors from:Government, Higher Education
Accessibility:Closed