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Publication

Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

Journal Contribution - Journal Article

Journal: MICROELECTRONICS RELIABILITY

ISSN: 0026-2714

Issue: 12

Volume: 54

Pages: 2860 - 2870

Publication year:2014

WoS Id: 000346954100031
DOI: https://doi.org/10.1016/j.microrel.2014.07.125
Handle: http://hdl.handle.net/1854/LU-5772829

Accessibility:Closed