< Back to previous page
Publication
Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers
Journal Contribution - Journal Article
Journal: Journal of the Electrochemical Society
ISSN: 0013-4651
Issue: 1
Volume: 157
Pages: D74 - D80
Publication year:2010
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:2
CSS-citation score:1
Authors from:Government, Higher Education