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Publication
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
Journal Contribution - Journal Article
Journal: Microelectronics Reliability
ISSN: 0026-2714
Volume: 102
Publication year:2019
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:1
Authors:International
Authors from:Government, Higher Education