< Back to previous pagePublication Effect of 4-point bending test procedure on crack propagation in thin film stacks Journal Contribution - Journal ArticleJournal: MICROELECTRONIC ENGINEERINGISSN: 0167-9317Volume: 137Pages: 59 - 63Institutional Repository URL: https://lirias.kuleuven.be/1941795Authors/publisherLuka Kljucar (First author)Mario Gonzalez (Author)Kris Vanstreels (Author)Andrej Ivankovic (Author)Michael Hecker (Author)Ingrid De Wolf (Last author)Research unitsStructural Composites and Alloys, Integrity and Nondestructive Testing(Division)KU Leuven
