Thermal management of integrated CMOS-Si photonics Optical Transceivers
Co-packaged photonic optical transceivers are under influence of spatial and temporal changing heat flux from neighbouring electronic components. This research focusses on assessing the effect of the thermal state on the optic field and in general the behaviour of the component under this heat load. The thermal modelling will range from the microscopic to macroscopic scale. If this modelling is accurate, then cooling methods tailored to this application can be developped in order to ensure optimal operation and lifetime. The obtained results will be validated experimentally.