Numerical simulations of plasmas and their surface processes, used for microelectronics applications.

The objectives for this project are to achieve a better insight in:1. the fundamental plasma behavior of novel STI gas mixtures, more specifically, Cl2/O2 in combination with CF4, CHF3, CH2F2 and HBr;2. the surface processes on the Si substrate and the reactor walls during plasma treatment, including trench profile evolution;3. the plasma uniformity in next generation 450 mm wafer reactors.

Keywords:PHYSICAL CHEMISTRY, MICRO ELECTRONICS, SURFACES

Disciplines:Applied mathematics in specific fields, Computer architecture and networks, Distributed computing, Information sciences, Information systems, Programming languages, Scientific computing, Theoretical computer science, Visual computing, Other information and computing sciences, Analytical chemistry, Inorganic chemistry, Macromolecular and materials chemistry, Organic chemistry, Theoretical and computational chemistry, Other chemical sciences