Fundamental Understanding and Characterization of Direct bonding and Hybrid bonding Technologies

Dielectric and hybrid bonding in die-to-wafer (D2W) and wafer-to-wafer (W2W) fashions opens up enormous opportunities in domains such as 3D interconnect scaling, imager application, MEMS technology and heterogenous layer integration. As the applications continue to evolve, bonding requirements are getting diversified and thus deep understanding of new material properties, bonding mechanism, process implementation and optimization is required for emerging technology needs.