< Back to previous page

Project

Flipchip machine for wide-IO chip bonding

Microelectronics is flourishing under Moore's law, which states that we can integrate an ever increasing number of transistors into a single chip. This allows to create increasingly complex circuits on chip, such as complete multi-core processors, which, for example, control our smartphones. KU Leuven plays at the top in this research domain.However, those increasingly complex chips are processing more and more data and are consuming more and more power. This augments the necessary number of inputs and outputs of the chip. Currently, commercial chips easily have several thousands of inputs / outputs, and research chips several hundreds.At KU Leuven we have equipment to connect our research chips to the outside world, in order to measure them in the lab. However, the current equipment is limited to ~ 150 in-/outputs for wire connections and ~ 20 in-/outputs for flipchip connections. Furthermore, wire connections are increasingly prohibitive for efficient power delivery and high throughput processing. We thus want to acquire new equipment to support bonding up to 800 in-/outputs with flipchip, to continue to lead the research in this blooming field.
Date:1 Jan 2021 →  31 Dec 2022
Keywords:Micro-electronics, Chip packaging, Wide bandwidth, Flipchip, Digital processors, Cryptography
Disciplines:Digital integrated circuits, Embedded systems, Neuromorphic computing, Computers and logic systems, Cryptography, privacy and security