< Back to previous page


A method for improving mechanical properties of polymer particles and its applications

The present invention is related to a method for improving the mechanical hardness of polymer particles. A method of the invention comprises a thermal cycle of heating and subsequently cooling. The disclosed method is applicable for use with combinations of preferably three monomers, said monomers having hydrophilic and hydrophobic groups in their polymer chain in order to achieve preferential orientation of the polymer chains in a polar solvent after applying the heating cycles of the invention (for example, but not limited to, polymethylmethacrylate and polystyrene based terpolymers and copolymers). The present invention is further related to polymeric abrasives used in slurry compositions for polishing copper and its use in a Chemical mechanical polishing method.
Patent Publication Number: EP1813641
Source: EPO
Year filing: 2006
Year approval: 2016
Year publication: 2016
Status: Assigned
Technology domains: Semiconductors, Basic materials chemistry, Machine tools, Other special machines
Validated for IOF-key: Yes
Attributed to: Associatie KULeuven